Modelling of chemical shrinkage evolution with curing degree of a filled epoxy adhesive
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Extent
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Online-Ressource
- Language
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Englisch
- Notes
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In: Holst, T.; Sayer, F.; Antoniou, A.: Modelling of chemical shrinkage evolution with curing degree of a filled epoxy adhesive. In: 41st Risø International Symposium on Materials Science: "Materials and Design for Next Generation Wind Turbine Blades". London [u.a.] : Institute of Physics, 2020 (IOP Conference Series: Materials Science and Engineering ; 942), 012020. DOI: https://doi.org/10.1088/1757-899x/942/1/012020
- Event
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Veröffentlichung
- (where)
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Hannover
- (who)
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Gottfried Wilhelm Leibniz Universität Hannover
- (when)
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2020
- Event
-
Veröffentlichung
- (where)
-
Hannover
- (who)
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Technische Informationsbibliothek (TIB)
- (when)
-
2020
- Creator
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Holst, T.
Sayer, F.
Antoniou, A.
- DOI
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10.15488/16454
- URN
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urn:nbn:de:101:1-2024031401130285935338
- Rights
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Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
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25.03.2025, 1:51 PM CET
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Holst, T.
- Sayer, F.
- Antoniou, A.
- Gottfried Wilhelm Leibniz Universität Hannover
- Technische Informationsbibliothek (TIB)
Time of origin
- 2020
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In situ curing and bonding of epoxy prepregs in epoxy thermoset injection molding
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