Hochschulschrift
Reliability analysis of foil substrate based integration of silicon chips
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
Online-Ressource
- Sprache
-
Englisch
- Anmerkungen
-
Dresden, Technische Universität Dresden, Dissertation, 2020
- Schlagwort
-
Reliability
Silicon
- Ereignis
-
Veröffentlichung
- (wo)
-
Dresden
- (wer)
-
Technische Universität Dresden
- (wann)
-
2020
- Urheber
- Beteiligte Personen und Organisationen
-
Bock, Karlheinz
Svasta, Paul
- URN
-
urn:nbn:de:bsz:14-qucosa2-730989
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
25.03.2025, 13:52 MEZ
Datenpartner
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Objekttyp
- Hochschulschrift
Beteiligte
- Palavesam, Nagarajan
- Bock, Karlheinz
- Svasta, Paul
- Technische Universität Dresden
Entstanden
- 2020
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