Hochschulschrift
Predicting the Bond Quality of heavy copper wire bonds using a friction model approach
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783844089035
3844089039
- Dimensions
-
21 cm, 254 g
- Extent
-
170 Seiten
- Edition
-
1. Auflage
- Language
-
Englisch
- Notes
-
Illustrationen
Universität Paderborn, Dissertation, 2022
- Bibliographic citation
-
Schriften des Lehrstuhls für Dynamik und Mechatronik ; Band 15
- Classification
-
Elektrotechnik, Elektronik
- Keyword
-
Leistungshalbleiter
Anschluss
Steckverbindung
Kupferdraht
Ultraschallbonden
- Event
-
Veröffentlichung
- (where)
-
Düren
- (who)
-
Shaker
- (when)
-
2023
- Creator
- Contributor
- Table of contents
- Rights
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Last update
-
11.03.2025, 11:53 AM CET
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Object type
- Hochschulschrift
Associated
- Althoff, Simon
- Shaker Verlag
- Shaker
Time of origin
- 2023
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