Hochschulschrift
Predicting the Bond Quality of heavy copper wire bonds using a friction model approach
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783844089035
3844089039
- Maße
-
21 cm, 254 g
- Umfang
-
170 Seiten
- Ausgabe
-
1. Auflage
- Sprache
-
Englisch
- Anmerkungen
-
Illustrationen
Universität Paderborn, Dissertation, 2022
- Erschienen in
-
Schriften des Lehrstuhls für Dynamik und Mechatronik ; Band 15
- Klassifikation
-
Elektrotechnik, Elektronik
- Schlagwort
-
Leistungshalbleiter
Anschluss
Steckverbindung
Kupferdraht
Ultraschallbonden
- Ereignis
-
Veröffentlichung
- (wo)
-
Düren
- (wer)
-
Shaker
- (wann)
-
2023
- Urheber
- Beteiligte Personen und Organisationen
- Inhaltsverzeichnis
- Rechteinformation
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Letzte Aktualisierung
-
11.06.2025, 13:43 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Objekttyp
- Hochschulschrift
Beteiligte
- Althoff, Simon
- Shaker Verlag
- Shaker
Entstanden
- 2023
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