- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783527346479
3527346473
- Dimensions
-
25 cm, 1130 g
- Extent
-
xii, 506 Seiten
- Language
-
Englisch
- Notes
-
Illustrationen
- Classification
-
Elektrotechnik, Elektronik
- Keyword
-
MEMS
Dreidimensionale Integration
System-on-Chip
SOI-Technik
Verbindungstechnik
Mikrosystemtechnik
CMOS
Integrierter Sensor
Wafer level packaging
Bonden
- Event
-
Veröffentlichung
- (where)
-
Weinheim, Germany
- (who)
-
Wiley-VCH
- (when)
-
[2021]
- Contributor
- Table of contents
- Rights
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Last update
-
11.06.2025, 1:47 PM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Object type
- Aufsatzsammlung
Associated
- Esashi, Masayoshi
- Wiley-VCH
- Wiley-VCH
Time of origin
- [2021]
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Handbook of 3D integration, Vol. 2.. Technology and applications of 3D integrated circuits
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The cosmic circuit of matter
CMOS-MEMS
3D laser microfabrication : principles and applications
Metal nano 3D superlattices : synthesis, properties, and applications
Process intensification and integration for sustainable design
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