3D Inkjet Printing of Electronics Using UV Conversion

Abstract: The production of electronic circuits and devices is limited by current manufacturing methods that limit both the form and potentially the performance of these systems. Additive manufacturing (AM) is a technology that has been shown to provide cross‐sectoral manufacturing industries with significant geometrical freedom. A research domain known as multifunctional AM (MFAM) in its infancy looks to couple the positive attributes of AM with application in the electronics sector can have a significant impact on the development of new products; however, there are significant hurdles to overcome. This paper reports on the single step MFAM of 3D electronic circuitry within a polymeric structure using a combination of conductive and nonconductive materials within a single material jetting‐based AM system. The basis of this breakthrough is a study of the optical absorption regions of a silver nanoparticle (AgNP) conductive ink which leads to a novel method to rapidly process and sinter AgNP inks in ambient conditions using simple UV radiation contemporaneously with UV‐curing of deposited polymeric structures.

Object Details

• Location: Deutsche Nationalbibliothek Frankfurt am Main
• Extent: Online-Ressource
• Language: Englisch

References and Relationships

• Bibliographic citation: 3D Inkjet Printing of Electronics Using UV Conversion ; volume:2 ; number:10 ; year:2017 ; extent:8 ; Advanced Materials Technologies ; 2, Heft 10 (2017) (gesamt 8)

Contributors, Places and Time

• Creator: Saleh, Ehab ; Zhang, Fan ; He, Yinfeng ; Vaithilingam, Jayasheelan ; Fernandez, Javier Ledesma ; Wildman, Ricky ; Ashcroft, Ian ; Hague, Richard ; Dickens, Phill ; Tuck, Christopher

Further information

• DOI: 10.1002/admt.201700134
• URN: urn:nbn:de:101:1-2022091606020316151382
• Rights: Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
• Last update: 15.08.2025, 7:37 AM CEST