Influence of Encapsulation Process Temperature on the Performance of Perovskite Mini Modules
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
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Online-Ressource
- Sprache
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Englisch
- Anmerkungen
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In: Baumann, S.; Brockmann, L.; Blankemeyer, S.; Steckenreiter, V.; Barnscheidt, V. et al.: Influence of Encapsulation Process Temperature on the Performance of Perovskite Mini Modules. In: Brendel, R. (Ed.): SiliconPV 2021, the 11th International Conference on Crystalline Silicon Photovoltaics. Melville, NY : Inst., 2022 (AIP conference proceedings ; 2487), 120001. DOI: https://doi.org/10.1063/5.0090632
- Klassifikation
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Elektrotechnik, Elektronik
- Ereignis
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Veröffentlichung
- (wo)
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Hannover
- (wer)
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Gottfried Wilhelm Leibniz Universität Hannover
- (wann)
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2022
- Ereignis
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Veröffentlichung
- (wo)
-
Hannover
- (wer)
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Technische Informationsbibliothek (TIB)
- (wann)
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2022
- Urheber
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Baumann, Sara
Brockmann, Lukas
Blankemeyer, Susanne
Steckenreiter, Verena
Barnscheidt, Verena
Köntges, Marc
Kajari-Schröder, Sarah
Wolter, Sascha Jozsef
Schulte-Huxel, Henning
Wietler, Tobias
- DOI
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10.15488/13776
- URN
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urn:nbn:de:101:1-2023060802165724547729
- Rechteinformation
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Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
25.03.2025, 13:54 MEZ
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Beteiligte
- Baumann, Sara
- Brockmann, Lukas
- Blankemeyer, Susanne
- Steckenreiter, Verena
- Barnscheidt, Verena
- Köntges, Marc
- Kajari-Schröder, Sarah
- Wolter, Sascha Jozsef
- Schulte-Huxel, Henning
- Wietler, Tobias
- Gottfried Wilhelm Leibniz Universität Hannover
- Technische Informationsbibliothek (TIB)
Entstanden
- 2022
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