Improving bonding strength by non-thermal atmospheric pressure plasma-assisted technology for A5052/PEEK direct joining

Location
Deutsche Nationalbibliothek Frankfurt am Main
Extent
1 Online-Ressource.
Language
Englisch

Bibliographic citation
Improving bonding strength by non-thermal atmospheric pressure plasma-assisted technology for A5052/PEEK direct joining ; volume:130 ; number:1-2 ; day:6 ; month:12 ; year:2023 ; pages:903-913 ; date:1.2024
The international journal of advanced manufacturing technology ; 130, Heft 1-2 (6.12.2023), 903-913, 1.2024

Creator
Takenaka, Kosuke
Jinda, Akiya
Nakamoto, Soutaro
Koyari, Ryosuke
Toko, Susumu
Uchida, Giichiro
Setsuhara, Yuichi
Contributor
SpringerLink (Online service)

DOI
10.1007/s00170-023-12747-6
URN
urn:nbn:de:101:1-2024031408511075895599
Rights
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Last update
14.08.2025, 10:50 AM CEST

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Associated

  • Takenaka, Kosuke
  • Jinda, Akiya
  • Nakamoto, Soutaro
  • Koyari, Ryosuke
  • Toko, Susumu
  • Uchida, Giichiro
  • Setsuhara, Yuichi
  • SpringerLink (Online service)

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