Improving bonding strength by non-thermal atmospheric pressure plasma-assisted technology for A5052/PEEK direct joining
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
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1 Online-Ressource.
- Sprache
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Englisch
- Erschienen in
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Improving bonding strength by non-thermal atmospheric pressure plasma-assisted technology for A5052/PEEK direct joining ; volume:130 ; number:1-2 ; day:6 ; month:12 ; year:2023 ; pages:903-913 ; date:1.2024
The international journal of advanced manufacturing technology ; 130, Heft 1-2 (6.12.2023), 903-913, 1.2024
- Urheber
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Takenaka, Kosuke
Jinda, Akiya
Nakamoto, Soutaro
Koyari, Ryosuke
Toko, Susumu
Uchida, Giichiro
Setsuhara, Yuichi
- Beteiligte Personen und Organisationen
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SpringerLink (Online service)
- DOI
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10.1007/s00170-023-12747-6
- URN
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urn:nbn:de:101:1-2024031408511075895599
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
- 14.08.2025, 10:50 MESZ
Datenpartner
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Beteiligte
- Takenaka, Kosuke
- Jinda, Akiya
- Nakamoto, Soutaro
- Koyari, Ryosuke
- Toko, Susumu
- Uchida, Giichiro
- Setsuhara, Yuichi
- SpringerLink (Online service)
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