Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Extent
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Online-Ressource, 1 online resource.
- Language
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Englisch
- Bibliographic citation
-
Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints ; volume:13 ; number:1 ; day:26 ; month:5 ; year:2023 ; pages:1-19 ; date:12.2023
Scientific reports ; 13, Heft 1 (26.5.2023), 1-19, 12.2023
- Classification
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Ingenieurwissenschaften und Maschinenbau
- Creator
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Bani Hani, Dania
Al Athamneh, Raed
Abueed, Mohammed
Hamasha, Sa’d
- Contributor
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SpringerLink (Online service)
- DOI
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10.1038/s41598-023-32460-4
- URN
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urn:nbn:de:101:1-2023091108274469682672
- Rights
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 10:51 AM CEST
Data provider
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Associated
- Bani Hani, Dania
- Al Athamneh, Raed
- Abueed, Mohammed
- Hamasha, Sa’d
- SpringerLink (Online service)
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Reliability assessment of lead- free solder joint, based on high cycle fatigue & creep studies on bulk specimen
CREEP FATIGUE, PART II: Creep Fatigue Life Prediction: Methods and Trends
Solder Joint Technology : Materials, Properties, and Reliability
Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder
Influence of the Substrate on the Creep of SN Solder Joints
Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction
Basic Creep-Fatigue Models Considering Cavitation
Reliability of solder interconnects under high current loading conditions
The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures
A New Creep-Fatigue Life Prediction Model
Creep-Fatigue Life Prediction - A Ductility Model
Component reliability under creep fatigue conditions
Reliability assessment of lead- free solder joint, based on high cycle fatigue & creep studies on bulk specimen
CREEP FATIGUE, PART II: Creep Fatigue Life Prediction: Methods and Trends
Solder Joint Technology : Materials, Properties, and Reliability
Evaluating Creep Deformation in Controlled Microstructures of Sn-3Ag-0.5Cu Solder
Influence of the Substrate on the Creep of SN Solder Joints
Primary Creep in Sn3.8Ag0.7Cu Solder. Part I: Theory, Experiments, and Data Reduction
Basic Creep-Fatigue Models Considering Cavitation
Reliability of solder interconnects under high current loading conditions
The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures
A New Creep-Fatigue Life Prediction Model