Hochschulschrift
Thermal and thermal-mechanical simulation for the prediction of fatigue processes in packages for power semiconductor devices
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783944640334
- Dimensions
-
21 cm
- Extent
-
XII, 170 S.
- Language
-
Englisch
- Notes
-
Ill., graph. Darst.
Zugl.: Chemnitz, Techn. Univ., Diss., 2014
- Classification
-
Elektrotechnik, Elektronik
- Keyword
-
Leistungshalbleiter
IGBT
Halbleitergehäuse
Verbindungstechnik
Halbleitersubstrat
Materialermüdung
Lebensdauer
Thermomechanische Eigenschaft
Temperaturverhalten
Finite-Elemente-Methode
Zuverlässigkeit
Simulation
- Table of contents
- Rights
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Last update
-
11.06.2025, 1:55 PM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Object type
- Hochschulschrift
Associated
- Poller, Tilo
- Univ.-Verl.
Time of origin
- 2014
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Method for thermal evaluation of automotive gearbox packages taking into account load point-dependent oil distribution
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