Thermal Stress Analysis for Functionally Graded Plates with Modulus Gradation, Part II

Location
Deutsche Nationalbibliothek Frankfurt am Main
Extent
1 Online-Ressource.
Language
Englisch

Bibliographic citation
Thermal Stress Analysis for Functionally Graded Plates with Modulus Gradation, Part II ; volume:64 ; number:8 ; day:27 ; month:6 ; year:2024 ; pages:1229-1247 ; date:10.2024
Experimental mechanics ; 64, Heft 8 (27.6.2024), 1229-1247, 10.2024

Creator
Baytak, T.
Tosun, M.
Ipek, C.
Mollamahmutoglu, C.
Bulut, O.
Contributor
SpringerLink (Online service)

DOI
10.1007/s11340-024-01091-9
URN
urn:nbn:de:101:1-2411160022081.664065795008
Rights
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Last update
15.08.2025, 7:36 AM CEST

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Associated

  • Baytak, T.
  • Tosun, M.
  • Ipek, C.
  • Mollamahmutoglu, C.
  • Bulut, O.
  • SpringerLink (Online service)

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