Thermal Stress Analysis for Functionally Graded Plates with Modulus Gradation, Part II
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
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1 Online-Ressource.
- Sprache
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Englisch
- Erschienen in
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Thermal Stress Analysis for Functionally Graded Plates with Modulus Gradation, Part II ; volume:64 ; number:8 ; day:27 ; month:6 ; year:2024 ; pages:1229-1247 ; date:10.2024
Experimental mechanics ; 64, Heft 8 (27.6.2024), 1229-1247, 10.2024
- Urheber
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Baytak, T.
Tosun, M.
Ipek, C.
Mollamahmutoglu, C.
Bulut, O.
- Beteiligte Personen und Organisationen
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SpringerLink (Online service)
- DOI
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10.1007/s11340-024-01091-9
- URN
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urn:nbn:de:101:1-2411160022081.664065795008
- Rechteinformation
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
15.08.2025, 07:36 MESZ
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Beteiligte
- Baytak, T.
- Tosun, M.
- Ipek, C.
- Mollamahmutoglu, C.
- Bulut, O.
- SpringerLink (Online service)
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