Cure kinetics modeling of a high glass transition temperature epoxy molding compound (EMC) based on inline dielectric analysis
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Extent
-
Online-Ressource
- Language
-
Englisch
- Bibliographic citation
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In: Polymers, 13.2021, 11, 1734
- Event
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Veröffentlichung
- (where)
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Reutlingen
- (who)
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Hochschule Reutlingen
- (when)
-
2021
- Creator
- DOI
-
10.3390/polym13111734
- URN
-
urn:nbn:de:bsz:rt2-opus4-31807
- Rights
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
25.03.2025, 1:41 PM CET
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Franieck, Erick
- Fleischmann, Martin
- Hölck, Ole
- Kutuzova, Larysa
- Kandelbauer, Andreas
- Hochschule Reutlingen
Time of origin
- 2021
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In situ curing and bonding of epoxy prepregs in epoxy thermoset injection molding
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Function-oriented in-line quality assurance of hybrid sheet molding compound
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Development of inline cure characterization methods of epoxy-based packaging materials for electronic packages via dielectric analysis
In situ curing and bonding of epoxy prepregs in epoxy thermoset injection molding
In‑line monitoring of carbon nanoparticle epoxy dispersion processes
Function-oriented in-line quality assurance of hybrid sheet molding compound
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Characterization of hermetically sealed metallic feedthroughs through injection-molded epoxy-molding compounds
EMC
EMC
Influence of Epoxy Spray Binder on Infusion and Cure in Liquid Composite Molding Processes
FUCK EMC
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