- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
-
1543-186X
- Umfang
-
Online-Ressource
- Sprache
-
Englisch
- Anmerkungen
-
online resource.
- Erschienen in
-
Nanocopper Based Solder-Free Electronic Assembly ; volume:43 ; number:12 ; day:1 ; month:11 ; year:2014 ; pages:4515-4521 ; date:12.2014
Journal of electronic materials ; 43, Heft 12 (1.11.2014), 4515-4521, 12.2014
- Urheber
-
Schnabl, K.
Wentlent, L.
Mootoo, K.
Khasawneh, S.
Zinn, A. A.
Beddow, J.
Hauptfleisch, E.
Blass, D.
Borgesen, P.
- Beteiligte Personen und Organisationen
-
SpringerLink (Online service)
- DOI
-
10.1007/s11664-014-3478-6
- URN
-
urn:nbn:de:101:1-2022021322073044346738
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
- 15.08.2025, 07:26 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Beteiligte
- Schnabl, K.
- Wentlent, L.
- Mootoo, K.
- Khasawneh, S.
- Zinn, A. A.
- Beddow, J.
- Hauptfleisch, E.
- Blass, D.
- Borgesen, P.
- SpringerLink (Online service)
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