- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783540401810
3540401814
- Maße
-
24 cm
- Umfang
-
IX, 140 S.
- Sprache
-
Englisch
- Anmerkungen
-
Ill., graph. Darst.
Literaturverz. S. 131 - 137
- Klassifikation
-
Ingenieurwissenschaften und Maschinenbau
- Schlagwort
-
System-on-Chip
Siliciumbauelement
Halbleitertechnologie
Kühlkörper
Wärmeübertragung
Temperaturmessung
- Ereignis
-
Veröffentlichung
- (wo)
-
Berlin, Heidelberg, New York, Hong Kong, London, Milan, Paris, Tokyo
- (wer)
-
Springer
- (wann)
-
2004
- Urheber
-
Zhang, Lian
Goodson, Kenneth E.
Kenny, Thomas W.
- Inhaltsverzeichnis
- Rechteinformation
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Letzte Aktualisierung
-
11.06.2025, 13:51 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Beteiligte
- Zhang, Lian
- Goodson, Kenneth E.
- Kenny, Thomas W.
- Springer
Entstanden
- 2004
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