Broadband THz Interconnect for Hybrid Integration of InP and Si Platforms

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Standort
Deutsche Nationalbibliothek Frankfurt am Main
Umfang
Online-Ressource
Sprache
Englisch
Anmerkungen
In:

This is the authors version of:
S. Iwamatsu, M. Ali, J. L. Fernandez-Estevez, S. Makhlouf, G. Carpintero and A. Stöhr, "Broadband THz Interconnect for Hybrid Integration of InP and Si Platforms," in: 2022 47th International Conference on Infrared, Millimeter and Terahertz Waves (IRMMW-THz), Delft, Netherlands, 2022. doi: 10.1109/IRMMW-THz50927.2022.9895647.

Date Added to IEEE Xplore: 26 September 2022

Changes were made to this version by the publisher prior to publication. The final version of record was published by IEEE and is available at https://doi.org/10.1109/IRMMW-THz50927.2022.9895647

Klassifikation
Elektrotechnik, Elektronik

Ereignis
Veröffentlichung
(wo)
Duisburg, Essen
(wer)
Universität Duisburg-Essen
(wann)
2023
Urheber
Iwamatsu, Shuya
Ali, Muhsin
Fernandez-Estevez, José Luis
Makhlouf, Sumer
Carpintero, Guillermo
Stöhr, Andreas

DOI
10.1109/IRMMW-THz50927.2022.9895647
URN
urn:nbn:de:hbz:465-20230330-163358-3
Rechteinformation
Open Access unbekannt; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Letzte Aktualisierung
14.08.2025, 10:44 MESZ

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  • 2023

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