Incorporation of copper in LaCoO3: modulating thermoelectric power factor for low- and mid-temperature thermoelectric applications
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
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1 Online-Ressource.
- Sprache
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Englisch
- Erschienen in
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Incorporation of copper in LaCoO3: modulating thermoelectric power factor for low- and mid-temperature thermoelectric applications ; volume:34 ; number:27 ; day:29 ; month:9 ; year:2023 ; pages:1-13 ; date:9.2023
Journal of materials science / Materials in electronics ; 34, Heft 27 (29.9.2023), 1-13, 9.2023
- Urheber
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U, Deepika Shanubhogue
Rao, Ashok
Mukherjee, Bodhoday
Okram, Gunadhor Singh
Davis, Nithya
Ashok, Anuradha M.
Poornesh, P.
- Beteiligte Personen und Organisationen
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SpringerLink (Online service)
- DOI
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10.1007/s10854-023-11339-0
- URN
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urn:nbn:de:101:1-2023122921003023046134
- Rechteinformation
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
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15.08.2025, 07:20 MESZ
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Beteiligte
- U, Deepika Shanubhogue
- Rao, Ashok
- Mukherjee, Bodhoday
- Okram, Gunadhor Singh
- Davis, Nithya
- Ashok, Anuradha M.
- Poornesh, P.
- SpringerLink (Online service)
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