Encapsulated Thermoelectric Modules and Compliant Pads for Advanced Thermoelectric Systems
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
-
1543-186X
- Umfang
-
Online-Ressource
- Sprache
-
Englisch
- Anmerkungen
-
online resource.
- Erschienen in
-
Encapsulated Thermoelectric Modules and Compliant Pads for Advanced Thermoelectric Systems ; volume:39 ; number:9 ; day:23 ; month:7 ; year:2010 ; pages:1418-1421 ; date:9.2010
Journal of electronic materials ; 39, Heft 9 (23.7.2010), 1418-1421, 9.2010
- Urheber
-
Kambe, Mitsuru
Jinushi, Takahiro
Ishijima, Zenzo
- Beteiligte Personen und Organisationen
-
SpringerLink (Online service)
- DOI
-
10.1007/s11664-010-1315-0
- URN
-
urn:nbn:de:101:1-2022021318000869899725
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
- 15.08.2025, 07:34 MESZ
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Beteiligte
- Kambe, Mitsuru
- Jinushi, Takahiro
- Ishijima, Zenzo
- SpringerLink (Online service)
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