Hochschulschrift
Simulation-based investigation of interface delamination in plastic IC packages under temperature and moisture loading
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- Extent
-
Online-Ressource
- Language
-
Englisch
- Notes
-
Berlin, Techn. Univ., Diss., 2010
- Classification
-
Elektrotechnik, Elektronik
- Keyword
-
Halbleitergehäuse
Epoxidharz
Thermoplastische Formmasse
Feuchtigkeit
Delamination
- Creator
- URN
-
urn:nbn:de:kobv:83-opus-27687
- Rights
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
15.08.2025, 7:28 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Object type
- Hochschulschrift
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