Hochschulschrift
Simulation-based investigation of interface delamination in plastic IC packages under temperature and moisture loading
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
Online-Ressource
- Sprache
-
Englisch
- Anmerkungen
-
Berlin, Techn. Univ., Diss., 2010
- Klassifikation
-
Elektrotechnik, Elektronik
- Schlagwort
-
Halbleitergehäuse
Epoxidharz
Thermoplastische Formmasse
Feuchtigkeit
Delamination
- Urheber
- URN
-
urn:nbn:de:kobv:83-opus-27687
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
25.03.2025, 13:50 MEZ
Datenpartner
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Objekttyp
- Hochschulschrift
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