Synergistic construction of thermally conductive network in polybenzoxazine with boron nitride hybrid fillers
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- Extent
-
Online-Ressource
- Language
-
Englisch
- Bibliographic citation
-
In: Materials Research Express 6.12 (2019): 125369.
- Event
-
Veröffentlichung
- (where)
-
Erlangen
- (who)
-
Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU)
- (when)
-
2020
- Creator
-
Yi, Wang
Wu, Wei
Drummer, Dietmar
Shen, Wanting
Chao, Liu
Ning, Wang
- DOI
-
10.1088/2053-1591/ab6e7d
- URN
-
urn:nbn:de:bvb:29-opus4-182584
- Rights
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
15.08.2025, 7:35 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Yi, Wang
- Wu, Wei
- Drummer, Dietmar
- Shen, Wanting
- Chao, Liu
- Ning, Wang
- Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU)
Time of origin
- 2020
Other Objects (12)
Influence of Filler Content and Filler Size on the Curing Kinetics of an Epoxy Resin
Achieving a 3D Thermally Conductive while Electrically Insulating Network in Polybenzoxazine with a Novel Hybrid Filler Composed of Boron Nitride and Carbon Nanotubes
Thermal Conductivity of Aluminosilicate- and Aluminum Oxide-Filled Thermosets for Injection Molding: Effect of Filler Content, Filler Size and Filler Geometry
Correlation between the Flow and Curing Behavior of Hard Magnetic Fillers in Thermosets and the Magnetic Properties
Influence of Different Filler Systems on the Thermal Conductivity and Mechanical Properties of Thermosets
Influence of Application Conditions on the Magnetic Properties of Recycled Polymer-Bonded Magnets Based on Thermoplastics and Ferrite-Based Fillers
Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron NitrideSilver Nanowires Thermal Network Filler
The Influence of the Design and Technological Parameters of Polymer-Based Multipolar Magnets with SrFeO Hard Magnetic Filler on the Residual Magnetic Properties
Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
Extension of the Application Range of Multipolar Bonded Ring Magnets by Thermosets in Comparison to Thermoplastics
Low‐stress over‐molding of media‐tight electronics using thermoplastic foam injection molding
Thermal Intra-Layer Interaction of Discretized Fractal Exposure Strategies in Non-Isothermal Powder Bed Fusion of Polypropylene
Influence of Filler Content and Filler Size on the Curing Kinetics of an Epoxy Resin
Achieving a 3D Thermally Conductive while Electrically Insulating Network in Polybenzoxazine with a Novel Hybrid Filler Composed of Boron Nitride and Carbon Nanotubes
Thermal Conductivity of Aluminosilicate- and Aluminum Oxide-Filled Thermosets for Injection Molding: Effect of Filler Content, Filler Size and Filler Geometry
Correlation between the Flow and Curing Behavior of Hard Magnetic Fillers in Thermosets and the Magnetic Properties
Influence of Different Filler Systems on the Thermal Conductivity and Mechanical Properties of Thermosets
Influence of Application Conditions on the Magnetic Properties of Recycled Polymer-Bonded Magnets Based on Thermoplastics and Ferrite-Based Fillers
Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron NitrideSilver Nanowires Thermal Network Filler
The Influence of the Design and Technological Parameters of Polymer-Based Multipolar Magnets with SrFeO Hard Magnetic Filler on the Residual Magnetic Properties
Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
Extension of the Application Range of Multipolar Bonded Ring Magnets by Thermosets in Comparison to Thermoplastics
Low‐stress over‐molding of media‐tight electronics using thermoplastic foam injection molding
Thermal Intra-Layer Interaction of Discretized Fractal Exposure Strategies in Non-Isothermal Powder Bed Fusion of Polypropylene
Influence of Filler Content and Filler Size on the Curing Kinetics of an Epoxy Resin
Achieving a 3D Thermally Conductive while Electrically Insulating Network in Polybenzoxazine with a Novel Hybrid Filler Composed of Boron Nitride and Carbon Nanotubes
Thermal Conductivity of Aluminosilicate- and Aluminum Oxide-Filled Thermosets for Injection Molding: Effect of Filler Content, Filler Size and Filler Geometry
Correlation between the Flow and Curing Behavior of Hard Magnetic Fillers in Thermosets and the Magnetic Properties
Influence of Different Filler Systems on the Thermal Conductivity and Mechanical Properties of Thermosets
Influence of Application Conditions on the Magnetic Properties of Recycled Polymer-Bonded Magnets Based on Thermoplastics and Ferrite-Based Fillers
Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron NitrideSilver Nanowires Thermal Network Filler
The Influence of the Design and Technological Parameters of Polymer-Based Multipolar Magnets with SrFeO Hard Magnetic Filler on the Residual Magnetic Properties
Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
Extension of the Application Range of Multipolar Bonded Ring Magnets by Thermosets in Comparison to Thermoplastics
Low‐stress over‐molding of media‐tight electronics using thermoplastic foam injection molding