Andreas Menzel
Hat mitgewirkt an:
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A large strain thermoplasticity model including recovery, recrystallisation and grain size effects
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Fundamentals of electro-mechanically coupled cohesive zone formulations for electrical conductors
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A finite element framework for thermo‐mechanically coupled gradient‐enhanced damage formulations
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Electrical and mechanical behaviour of metal thin films with deformation-induced cracks predicted by computational homogenisation