Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
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2041-1723
- Extent
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Online-Ressource
- Language
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Englisch
- Notes
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online resource.
- Bibliographic citation
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Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration ; volume:13 ; number:1 ; day:4 ; month:10 ; year:2022 ; pages:1-8 ; date:12.2022
Nature Communications ; 13, Heft 1 (4.10.2022), 1-8, 12.2022
- Creator
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Li, Ming-Ding
Shen, Xiao-Quan
Chen, Xin
Gan, Jia-Ming
Wang, Fang
Li, Jian
Wang, Xiao-Liang
Shen, Qun-Dong
- Contributor
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SpringerLink (Online service)
- DOI
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10.1038/s41467-022-33596-z
- URN
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urn:nbn:de:101:1-2022122409305146064670
- Rights
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
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15.08.2025, 7:32 AM CEST
Data provider
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Li, Ming-Ding
- Shen, Xiao-Quan
- Chen, Xin
- Gan, Jia-Ming
- Wang, Fang
- Li, Jian
- Wang, Xiao-Liang
- Shen, Qun-Dong
- SpringerLink (Online service)