Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration

Location
Deutsche Nationalbibliothek Frankfurt am Main
ISSN
2041-1723
Extent
Online-Ressource
Language
Englisch
Notes
online resource.

Bibliographic citation
Thermal management of chips by a device prototype using synergistic effects of 3-D heat-conductive network and electrocaloric refrigeration ; volume:13 ; number:1 ; day:4 ; month:10 ; year:2022 ; pages:1-8 ; date:12.2022
Nature Communications ; 13, Heft 1 (4.10.2022), 1-8, 12.2022

Creator
Li, Ming-Ding
Shen, Xiao-Quan
Chen, Xin
Gan, Jia-Ming
Wang, Fang
Li, Jian
Wang, Xiao-Liang
Shen, Qun-Dong
Contributor
SpringerLink (Online service)

DOI
10.1038/s41467-022-33596-z
URN
urn:nbn:de:101:1-2022122409305146064670
Rights
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Last update
15.08.2025, 7:32 AM CEST

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Associated

  • Li, Ming-Ding
  • Shen, Xiao-Quan
  • Chen, Xin
  • Gan, Jia-Ming
  • Wang, Fang
  • Li, Jian
  • Wang, Xiao-Liang
  • Shen, Qun-Dong
  • SpringerLink (Online service)

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