Cobalt‐Ion Superhygroscopic Hydrogels Serve as Chip Heat Sinks Achieving a 5 °C Temperature Reduction via Evaporative Cooling
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Extent
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Online-Ressource
- Language
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Englisch
- Bibliographic citation
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Cobalt‐Ion Superhygroscopic Hydrogels Serve as Chip Heat Sinks Achieving a 5 °C Temperature Reduction via Evaporative Cooling ; day:18 ; month:04 ; year:2024 ; extent:9
Small Methods ; (18.04.2024) (gesamt 9)
- Creator
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Xi, Mufeng
Zhang, Xiaohu
Liu, Hong
Xu, Bolin
Zheng, Yongliang
Du, Yujie
Yang, Lin
Ravi, Sai Kishore
- DOI
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10.1002/smtd.202301753
- URN
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urn:nbn:de:101:1-2404181421282.375343071182
- Rights
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
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14.08.2025, 10:53 AM CEST
Data provider
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Xi, Mufeng
- Zhang, Xiaohu
- Liu, Hong
- Xu, Bolin
- Zheng, Yongliang
- Du, Yujie
- Yang, Lin
- Ravi, Sai Kishore