Cobalt‐Ion Superhygroscopic Hydrogels Serve as Chip Heat Sinks Achieving a 5 °C Temperature Reduction via Evaporative Cooling

Location
Deutsche Nationalbibliothek Frankfurt am Main
Extent
Online-Ressource
Language
Englisch

Bibliographic citation
Cobalt‐Ion Superhygroscopic Hydrogels Serve as Chip Heat Sinks Achieving a 5 °C Temperature Reduction via Evaporative Cooling ; day:18 ; month:04 ; year:2024 ; extent:9
Small Methods ; (18.04.2024) (gesamt 9)

Creator
Xi, Mufeng
Zhang, Xiaohu
Liu, Hong
Xu, Bolin
Zheng, Yongliang
Du, Yujie
Yang, Lin
Ravi, Sai Kishore

DOI
10.1002/smtd.202301753
URN
urn:nbn:de:101:1-2404181421282.375343071182
Rights
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Last update
14.08.2025, 10:53 AM CEST

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Associated

  • Xi, Mufeng
  • Zhang, Xiaohu
  • Liu, Hong
  • Xu, Bolin
  • Zheng, Yongliang
  • Du, Yujie
  • Yang, Lin
  • Ravi, Sai Kishore

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