Hochschulschrift
Influence of different additives on the copper electroplating onto Au(111) and Cu(111) substrates
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Maße
-
21 cm
- Umfang
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IV, 229 S.
- Sprache
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Englisch
- Anmerkungen
-
Ill., graph. Darst.
Ulm, Univ., Diss., 2006
- Schlagwort
-
Additiv
Galvanische Abscheidung
Adsorption
Kupfer
Elektrochemie
- Urheber
- URN
-
urn:nbn:de:bsz:289-vts-58116
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
25.03.2025, 13:49 MEZ
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- Hochschulschrift
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