Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives

Location
Deutsche Nationalbibliothek Frankfurt am Main
ISSN
1543-186X
Extent
Online-Ressource
Language
Englisch
Notes
online resource.

Bibliographic citation
Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives ; volume:36 ; number:10 ; day:18 ; month:8 ; year:2007 ; pages:1341-1347 ; date:10.2007
Journal of electronic materials ; 36, Heft 10 (18.8.2007), 1341-1347, 10.2007

Creator
Yim, Myung Jin
Li, Yi
Moon, Kyoung Sik
Wong, C.P
Contributor
SpringerLink (Online service)

DOI
10.1007/s11664-007-0204-7
URN
urn:nbn:de:101:1-2021083022343076114897
Rights
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Last update
15.08.2025, 7:36 AM CEST

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Associated

  • Yim, Myung Jin
  • Li, Yi
  • Moon, Kyoung Sik
  • Wong, C.P
  • SpringerLink (Online service)

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