- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
-
1573-482X
- Extent
-
Online-Ressource
- Language
-
Englisch
- Notes
-
online resource.
- Bibliographic citation
-
Early stages of wetting of copper by Sn–Zn eutectic alloy ; volume:29 ; number:24 ; day:17 ; month:10 ; year:2018 ; pages:20531-20545 ; date:12.2018
Journal of materials science / Materials in electronics ; 29, Heft 24 (17.10.2018), 20531-20545, 12.2018
- Classification
-
Ingenieurwissenschaften und Maschinenbau
- Creator
-
Pstruś, J.
- Contributor
-
SpringerLink (Online service)
- DOI
-
10.1007/s10854-018-0197-4
- URN
-
urn:nbn:de:101:1-2018122219051997966352
- Rights
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 10:56 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Pstruś, J.
- SpringerLink (Online service)
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Eutectic Solidification Morphologies in Rapidly Solidified Hypereutectic Sn–Ag Solder Alloy
Reactive wetting behaviors of Sn/Cu systems: A molecular dynamics study
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Physicochemical Properties of Sb, Sn, Zn, and Sb–Sn System
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8. Die Diffusion von Zn im System Sn-Zn
Eutectic Solidification Morphologies in Rapidly Solidified Hypereutectic Sn–Ag Solder Alloy
Reactive wetting behaviors of Sn/Cu systems: A molecular dynamics study
Wetting and Interfacial Chemistry of New Pb-Free Sn-Zn-Ag-Al-Li (SZAAL) Solder with Cu, Ni, and Al Substrates