TOPCon Solar Cells With Al-Free Ag and Cu Metallization : Strategies for Ag Reduction in Industrial Silicon Solar Cells
Abstract: This work presents an approach to lower the silver consumption of screen printed TOPCon (Tunnel Oxide Passivated Contact) solar cells by reducing and partially replacing the silver by low cost copper metallization paste. On the solar cells front side an adapted process sequence enables the use of a pure Ag paste, which compared to the industrially established AgAl paste offers a better conductivity and respectively requires less laydown to enable similarly low grid resistance. On the solar cells rear side the conductivity of the metal grid is accomplished by a copper paste which is realized within a print-on-print step on top of the Ag contact layer with minimized laydown. A reduction in Ag paste consumption by 40% to less than 9 mg/ Wp without sacrificing conversion efficiency seems achievable and can enable a significant cost reduction for TOPCon solar cells. https://www.tib-op.org/ojs/index.php/siliconpv/article/view/1316
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
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Online-Ressource
- Sprache
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Englisch
- Erschienen in
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TOPCon Solar Cells With Al-Free Ag and Cu Metallization ; volume:2 ; year:2024
SiliconPV conference proceedings ; 2 (2024)
- Urheber
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Lossen, Jan
Preis, Pirmin
Comak, Mertcan
Libal, Joris
Rudolph , Dominik
Hoß, Jan
Koduvelikulathu, Lejo Joseph
- DOI
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10.52825/siliconpv.v2i.1316
- URN
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urn:nbn:de:101:1-2501250240230.998219532530
- Rechteinformation
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
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15.08.2025, 07:23 MESZ
Datenpartner
Deutsche Nationalbibliothek. Bei Fragen zum Objekt wenden Sie sich bitte an den Datenpartner.
Beteiligte
- Lossen, Jan
- Preis, Pirmin
- Comak, Mertcan
- Libal, Joris
- Rudolph , Dominik
- Hoß, Jan
- Koduvelikulathu, Lejo Joseph
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