Reliability study of electronic components on board-level packages encapsulated by thermoset injection molding
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
-
Online-Ressource
- Sprache
-
Englisch
- Erschienen in
-
In: Journal of manufacturing and materials processing 4 (2020), No. 26
- Ereignis
-
Veröffentlichung
- (wo)
-
Stuttgart
- (wer)
-
Universitätsbibliothek der Universität Stuttgart
- (wann)
-
2020
- Urheber
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Kulkarni, Romit
Soltani, Mahdi
Wappler, Peter
Guenther, Thomas
Fritz, Karl-Peter
Groezinger, Tobias
Zimmermann, André
- DOI
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10.18419/opus-15060
- URN
-
urn:nbn:de:bsz:93-opus-ds-150790
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
15.08.2025, 07:29 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Beteiligte
- Kulkarni, Romit
- Soltani, Mahdi
- Wappler, Peter
- Guenther, Thomas
- Fritz, Karl-Peter
- Groezinger, Tobias
- Zimmermann, André
- Universitätsbibliothek der Universität Stuttgart
Entstanden
- 2020
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