Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers

Location
Deutsche Nationalbibliothek Frankfurt am Main
ISSN
1556-276X
Extent
Online-Ressource
Language
Englisch
Notes
online resource.

Bibliographic citation
Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers ; volume:9 ; number:1 ; day:29 ; month:11 ; year:2014 ; pages:1-7 ; date:12.2014
Nanoscale research letters ; 9, Heft 1 (29.11.2014), 1-7, 12.2014

Creator
Wang, Zifeng
Fu, Yuqiao
Meng, Wenjun
Zhi, Chunyi
Contributor
SpringerLink (Online service)

DOI
10.1186/1556-276X-9-643
URN
urn:nbn:de:101:1-2021082109414782594686
Rights
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Last update
14.08.2025, 10:50 AM CEST

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Associated

  • Wang, Zifeng
  • Fu, Yuqiao
  • Meng, Wenjun
  • Zhi, Chunyi
  • SpringerLink (Online service)

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