Ultrafast Laser Welding of Silicon
While ultrafast laser welding is an appealing technique for bonding transparent workpieces, it is not applicable for joining silicon samples due to nonlinear propagation effects which dramatically diminish the possible energy deposition at the interface. It is demonstrated that these limitations can be circumvented by local absorption enhancement at the interface thanks to metallic nanolayer deposition. By combining the resulting exalted absorption with filament relocation during ultrafast laser irradiation, silicon samples can be efficiently joined. Shear joining strengths >4 MPa are obtained for 21 nm gold nanolayers without laser‐induced alteration of the transmittance. Such remarkable strength values hold promise for applications in microelectronics, optics, and astronomy.
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Extent
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Online-Ressource
- Language
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Englisch
- Bibliographic citation
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Ultrafast Laser Welding of Silicon ; day:26 ; month:02 ; year:2023 ; extent:7
Advanced photonics research ; (26.02.2023) (gesamt 7)
- Creator
- DOI
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10.1002/adpr.202200300
- URN
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urn:nbn:de:101:1-2023022714103258003490
- Rights
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
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14.08.2025, 10:46 AM CEST
Data provider
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Chambonneau, Maxime
- Li, Qingfeng
- Blothe, Markus
- Arumugam, Stree Vithya
- Nolte, Stefan
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