Active Matrix Flexible Sensory Systems: Materials, Design, Fabrication, and Integration

A variety of modern applications including soft robotics, prosthetics, and health monitoring devices that cover electronic skins (e‐skins), wearables as well as implants have been developed within the last two decades to bridge the gap between artificial and biological systems. During this development, high‐density integration of various sensing modalities into flexible electronic devices becomes vitally important to improve the perception and interaction of the human bodies and robotic appliances with external environment. As a key component in flexible electronics, the flexible thin‐film transistors (TFTs) have seen significant advances, allowing for building flexible active matrices. The flexible active matrices have been integrated with distributed arrays of sensing elements, enabling the detection of signals over a large area. The integration of sensors within pixels of flexible active matrices has brought the application scenarios to a higher level of sophistication with many advanced functionalities. Herein, recent progress in the active matrix flexible sensory systems is reviewed. The materials used to construct the semiconductor channels, the dielectric layers, and the flexible substrates for the active matrices are summarized. The pixel designs and fabrication strategies for the active matrix flexible sensory systems are briefly discussed. The applications of the flexible sensory systems are exemplified by reviewing pressure sensors, temperature sensors, photodetectors, magnetic sensors, and biosignal sensors. At the end, the recent development is summarized and the vision on the further advances of flexible active matrix sensory systems is provided.

Angaben zum Objekt

• Standort: Deutsche Nationalbibliothek Frankfurt am Main
• Umfang: Online-Ressource
• Sprache: Englisch

Verweise und Beziehungen

• Erschienen in: Active Matrix Flexible Sensory Systems: Materials, Design, Fabrication, and Integration ; day:29 ; month:05 ; year:2022 ; extent:32 ; Advanced intelligent systems ; (29.05.2022) (gesamt 32)

Beteiligte, Orts- und Zeitangaben

• Urheber: Bao, Bin ; Karnaushenko, Dmitriy D. ; Schmidt, Oliver G. ; Song, Yanlin ; Karnaushenko, Daniil

Weitere Informationen

• DOI: 10.1002/aisy.202100253
• URN: urn:nbn:de:101:1-2022053015140765586404
• Rechteinformation: Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
• Letzte Aktualisierung: 15.08.2025, 07:20 MESZ