Comparing low-temperature thermal and plasma sintering processes of a tailored silver particle-free ink
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- Extent
-
Online-Ressource
- Language
-
Englisch
- Bibliographic citation
-
In: Journal of materials science, Band 32, Ausgabe 5, Seite 6312-6322, 2021
- Event
-
Veröffentlichung
- (where)
-
Berlin
- (who)
-
Humboldt-Universität zu Berlin
- (when)
-
2023
- Creator
- DOI
-
10.1007/s10854-021-05347-1
- URN
-
urn:nbn:de:kobv:11-110-18452/27409-6
- Rights
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 11:00 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Yang, Wendong
- Hermerschmidt, Felix
- Mathies, Florian
- List-Kratochvil, Emil
- Humboldt-Universität zu Berlin
Time of origin
- 2023
Other Objects (12)
Systematic Investigation of Novel, Controlled Low‐Temperature Sintering Processes for Inkjet Printed Silver Nanoparticle Ink
Recyclability‐by‐design of Printed Electronics by Low‐Temperature Sintering of Silver Microparticles
Nano-Silver Ink of High Conductivity and Low Sintering Temperature for Paper Electronics
Sintering and applications of inkjetprinted silver nanoparticles
Low-Temperature Sintering of Colloidal Gold Nanoparticles by Salt Addition
Ultrasonic‐Enabled Nondestructive and Substrate‐Independent Liquid Metal Ink Sintering
Low-Temperature Sintering of Nanosilver Paste on a Gold Film Surface
Low-temperature silver-based ink for highly conductive paths through industrial printing processes suitable for thermally sensitive substrates and beyond
Silver–Alumina Catalysts for Low-Temperature Methanol Incineration
Is ink heating a relevant concern in the High Speed Sintering process?
Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper
Low-temperature sintering of CuAG microparticles in air for recyclable printed electronics
Systematic Investigation of Novel, Controlled Low‐Temperature Sintering Processes for Inkjet Printed Silver Nanoparticle Ink
Recyclability‐by‐design of Printed Electronics by Low‐Temperature Sintering of Silver Microparticles
Nano-Silver Ink of High Conductivity and Low Sintering Temperature for Paper Electronics
Sintering and applications of inkjetprinted silver nanoparticles
Low-Temperature Sintering of Colloidal Gold Nanoparticles by Salt Addition
Ultrasonic‐Enabled Nondestructive and Substrate‐Independent Liquid Metal Ink Sintering
Low-Temperature Sintering of Nanosilver Paste on a Gold Film Surface
Low-temperature silver-based ink for highly conductive paths through industrial printing processes suitable for thermally sensitive substrates and beyond
Silver–Alumina Catalysts for Low-Temperature Methanol Incineration
Is ink heating a relevant concern in the High Speed Sintering process?
Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper
Low-temperature sintering of CuAG microparticles in air for recyclable printed electronics
Systematic Investigation of Novel, Controlled Low‐Temperature Sintering Processes for Inkjet Printed Silver Nanoparticle Ink
Recyclability‐by‐design of Printed Electronics by Low‐Temperature Sintering of Silver Microparticles
Nano-Silver Ink of High Conductivity and Low Sintering Temperature for Paper Electronics
Sintering and applications of inkjetprinted silver nanoparticles
Low-Temperature Sintering of Colloidal Gold Nanoparticles by Salt Addition
Ultrasonic‐Enabled Nondestructive and Substrate‐Independent Liquid Metal Ink Sintering
Low-Temperature Sintering of Nanosilver Paste on a Gold Film Surface
Low-temperature silver-based ink for highly conductive paths through industrial printing processes suitable for thermally sensitive substrates and beyond
Silver–Alumina Catalysts for Low-Temperature Methanol Incineration
Is ink heating a relevant concern in the High Speed Sintering process?
Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper