Enhanced Heat Dissipation for Macroscopic Metals Achieved by a Single‐Layer Graphene

Abstract: The increasing demand for high‐performance devices on heat dissipation makes it approach the bottleneck even for metals with high thermal conductivities. The coating of only one layer of graphene, the heat dissipation performances of Cu, Ag, and Al can be further enhanced, e.g., with a maximum temperature reduction by ≈9% for a Cu foil is demonstrated. Molecular dynamics (MD) analysis of spectral phonon transmission reveals that low‐frequency phonons play a significant role in the thermal transport within the Cu/single‐layer graphene (SLG) system, and the high‐frequency phonons exhibit substantial mismatch. It suggests that the thermal anisotropy of graphene enables a rapid heat dispersion in the in‐plane direction and provides an effective thermal insulation in the out‐of‐plane direction. The thermal conductivity calculations demonstrate an enhanced participation of phonons in heat conduction by the graphene layer, indicating a novel heat conduction mechanism in the Cu/single‐layer graphene system. These findings highlight the positive impact of graphene on the heat conduction of metals, and they will hold crucial implications for the design and application of graphene‐based thermal devices is believed.

Standort
Deutsche Nationalbibliothek Frankfurt am Main
Umfang
Online-Ressource
Sprache
Englisch

Erschienen in
Enhanced Heat Dissipation for Macroscopic Metals Achieved by a Single‐Layer Graphene ; day:09 ; month:01 ; year:2024 ; extent:9
Advanced materials interfaces ; (09.01.2024) (gesamt 9)

Urheber
Fang, Jiayuan
Xu, Xujun
Zhang, Yang
Ren, Qiancheng
Wei, Ning
Zhao, Pei

DOI
10.1002/admi.202300877
URN
urn:nbn:de:101:1-2024011014073378973560
Rechteinformation
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Letzte Aktualisierung
15.08.2025, 07:21 MESZ

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Beteiligte

  • Fang, Jiayuan
  • Xu, Xujun
  • Zhang, Yang
  • Ren, Qiancheng
  • Wei, Ning
  • Zhao, Pei

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