Recombinant expression, purification and copper-binding characteristics of the amino terminus of a Plasmodium falciparum copper transport protein
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
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1475-2875
- Extent
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Online-Ressource
- Language
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Englisch
- Notes
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online resource.
- Bibliographic citation
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Recombinant expression, purification and copper-binding characteristics of the amino terminus of a Plasmodium falciparum copper transport protein ; volume:9 ; number:2 ; day:16 ; month:12 ; year:2010 ; pages:1 ; date:12.2010
Malaria journal ; 9, Heft 2 (16.12.2010), 1, 12.2010
- Creator
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Choveaux, David
- Contributor
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Goldring, JP Dean
SpringerLink (Online service)
- DOI
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10.1186/1475-2875-9-S2-P62
- URN
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urn:nbn:de:1111-2016080625355
- Rights
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Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
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14.08.2025, 10:49 AM CEST
Data provider
This object is provided by:
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Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Choveaux, David
- Goldring, JP Dean
- SpringerLink (Online service)
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Color of Copper/Copper Oxide
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Copper-promoted/copper-catalyzed trifluoromethylselenolation reactions
Ultra‐Tough Copper–Copper Bonding by Nano‐Oxide‐Dispersed Copper Nanomembranes
Corrosion resistance of copper and copper alloys : corrosive agents and their interaction with copper and copper alloys
Recommended machining parameters for copper and copper alloys
Recommended machining parameters for copper and copper alloys
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper–copper bonding
Copper phenoxyl complexes
A Plasmodium falciparum copper-binding membrane protein with copper transport motifs
Color of Copper/Copper Oxide
COPPER
The C-Terminus of Human Copper Importer Ctr1 Acts as a Binding Site and Transfers Copper to Atox1
Copper-promoted/copper-catalyzed trifluoromethylselenolation reactions
Ultra‐Tough Copper–Copper Bonding by Nano‐Oxide‐Dispersed Copper Nanomembranes
Corrosion resistance of copper and copper alloys : corrosive agents and their interaction with copper and copper alloys
Recommended machining parameters for copper and copper alloys
Recommended machining parameters for copper and copper alloys
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
Anti-oxidant copper layer by remote mode N2 plasma for low temperature copper–copper bonding