Handbook of wafer bonding

to related objects

Location: Deutsche Nationalbibliothek Frankfurt am Main

ISBN: 9783527326464
3527326464

Dimensions: 25 cm

Extent: XXXI, 395 S.

Language: Englisch

Notes: Ill., graph. Darst.
Literaturangaben

Classification: Elektrotechnik, Elektronik

Keyword: Wafer
Bonden
MEMS

Event: Veröffentlichung

(where): Weinheim

(who): Wiley-VCH-Verl.

(when): 2012

Contributor: Ramm, Peter
Lu, James Jian-Qiang
Taklo, Maaike M. V.

Table of contents: https://d-nb.info/1013143949/04

Rights: Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.

Last update: 11.06.2025, 2:24 PM CEST

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Ramm, Peter
Lu, James Jian-Qiang
Taklo, Maaike M. V.
Wiley-VCH-Verl.

Time of origin

2012

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Handbook of wafer bonding

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Time of origin

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