Dislocation transmission through coherent and incoherent twin boundaries copper at the micron scale
- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- Extent
-
Online-Ressource
- Language
-
Englisch
- Notes
-
Bochum, Ruhr-Universität Bochum, Dissertation, 2023
- Keyword
-
Versetzung
Metallischer Werkstoff
Mikrostruktur
Kupfer
Size-Effekt
Aluminium
Bewegte Versetzung
Kompression
Mechanische Eigenschaft
Metall
Kubisch flächenzentriertes Gitter
- Event
-
Veröffentlichung
- (where)
-
Bochum
- (who)
-
Ruhr-Universität Bochum
- (when)
-
2024
- Creator
- Contributor
-
Dehm, Gerhard
Kirchlechner, Christoph
Fakultät für Maschinenbau
- URN
-
urn:nbn:de:hbz:294-110218
- Rights
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 10:46 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Hosseinabadi, Reza
- Dehm, Gerhard
- Kirchlechner, Christoph
- Fakultät für Maschinenbau
- Ruhr-Universität Bochum
Time of origin
- 2024
Other Objects (12)
Dislocation transmission through copper grain boundaries at the micron scale
Probing dislocation nucleation in grains and at Σ3 twin boundaries of Cu alloys using nanoindentation
Effect of Oxygen on High‐temperature Phase Equilibria in Ternary Ti‐Al‐Nb Alloys
Implication of grain-boundary structure and chemistry on plasticity and failure
Structure, chemistry and nanomechanics of grain boundaries in Cu-Ag alloys
Fundamental investigation of the atomic structures of [111] tilt grain boundaries, their defects and segregation behaviour in pure and alloyed Al
The mechanical behavior of thin metallic films on flexible polymer substrate
Mikromechanische Untersuchungen zum Verhalten von Werkstoffen unter Scherbeanspruchung
Nanostructure, thermal stability and mechanical properties of vapor phase deposited supersaturated Cu-Cr thin film alloys
Micromechanical characterization of lead-free solder and its individual microstructure elements
Al-rich Fe-Al based alloys
Insight into indentation-induced plastic flow in austenitic stainless steel
Dislocation transmission through copper grain boundaries at the micron scale
Probing dislocation nucleation in grains and at Σ3 twin boundaries of Cu alloys using nanoindentation
Effect of Oxygen on High‐temperature Phase Equilibria in Ternary Ti‐Al‐Nb Alloys
Implication of grain-boundary structure and chemistry on plasticity and failure
Structure, chemistry and nanomechanics of grain boundaries in Cu-Ag alloys
Fundamental investigation of the atomic structures of [111] tilt grain boundaries, their defects and segregation behaviour in pure and alloyed Al
The mechanical behavior of thin metallic films on flexible polymer substrate
Mikromechanische Untersuchungen zum Verhalten von Werkstoffen unter Scherbeanspruchung
Nanostructure, thermal stability and mechanical properties of vapor phase deposited supersaturated Cu-Cr thin film alloys
Micromechanical characterization of lead-free solder and its individual microstructure elements
Al-rich Fe-Al based alloys
Insight into indentation-induced plastic flow in austenitic stainless steel
Dislocation transmission through copper grain boundaries at the micron scale
Probing dislocation nucleation in grains and at Σ3 twin boundaries of Cu alloys using nanoindentation
Effect of Oxygen on High‐temperature Phase Equilibria in Ternary Ti‐Al‐Nb Alloys
Implication of grain-boundary structure and chemistry on plasticity and failure
Structure, chemistry and nanomechanics of grain boundaries in Cu-Ag alloys
Fundamental investigation of the atomic structures of [111] tilt grain boundaries, their defects and segregation behaviour in pure and alloyed Al
The mechanical behavior of thin metallic films on flexible polymer substrate
Mikromechanische Untersuchungen zum Verhalten von Werkstoffen unter Scherbeanspruchung
Nanostructure, thermal stability and mechanical properties of vapor phase deposited supersaturated Cu-Cr thin film alloys
Micromechanical characterization of lead-free solder and its individual microstructure elements
Al-rich Fe-Al based alloys