Indium Bump Bonding: Advanced Integration Techniques for Low-Temperature Detectors and Readout
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
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1 Online-Ressource.
- Sprache
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Englisch
- Erschienen in
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Indium Bump Bonding: Advanced Integration Techniques for Low-Temperature Detectors and Readout ; day:20 ; month:4 ; year:2024 ; pages:1-6
Journal of low temperature physics ; (20.4.2024), 1-6
- Urheber
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Lucas, T. J.
Biesecker, J. P.
Doriese, W. B.
Duff, S. M.
Durkin, M. S.
Lew, R. A.
Ullom, J. N.
Vissers, M. R.
Schmidt, D. R.
- Beteiligte Personen und Organisationen
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SpringerLink (Online service)
- DOI
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10.1007/s10909-024-03104-2
- URN
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urn:nbn:de:101:1-2407022112318.584046549675
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
-
14.08.2025, 10:46 MESZ
Datenpartner
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Beteiligte
- Lucas, T. J.
- Biesecker, J. P.
- Doriese, W. B.
- Duff, S. M.
- Durkin, M. S.
- Lew, R. A.
- Ullom, J. N.
- Vissers, M. R.
- Schmidt, D. R.
- SpringerLink (Online service)
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