Microstructure and Mechanical Properties of Low Stacking-Fault Energy Cu-Based Alloy Wires
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
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1 Online-Ressource.
- Sprache
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Englisch
- Erschienen in
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Microstructure and Mechanical Properties of Low Stacking-Fault Energy Cu-Based Alloy Wires ; volume:55 ; number:11 ; day:6 ; month:9 ; year:2024 ; pages:4482-4493 ; date:11.2024
Metallurgical and materials transactions / A. A, Physical metallurgy and materials science ; 55, Heft 11 (6.9.2024), 4482-4493, 11.2024
- Urheber
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Semboshi, Satoshi
Arauchi, Ryusei
Kaneno, Yasuyuki
Lim, Sung Hwan
Choi, Eun-Ae
Han, Seung Zeon
- Beteiligte Personen und Organisationen
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SpringerLink (Online service)
- DOI
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10.1007/s11661-024-07566-7
- URN
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urn:nbn:de:101:1-2501012107010.600399699813
- Rechteinformation
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
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15.08.2025, 07:30 MESZ
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Beteiligte
- Semboshi, Satoshi
- Arauchi, Ryusei
- Kaneno, Yasuyuki
- Lim, Sung Hwan
- Choi, Eun-Ae
- Han, Seung Zeon
- SpringerLink (Online service)
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