Re‐Entrant Microstructures for Robust Liquid Repellent Surfaces

Abstract: Superhydrophobic surfaces have many interesting applications because of their self‐cleaning, waterproof, anti‐biofouling, anti‐corrosion, and low‐adhesion properties. Accordingly, numerous surfaces with hierarchical micro/nanostructures are designed and engineered to achieve superhydrophobicity. However, these surfaces have two major problems. First, they lose superhydrophobic properties over time, primarily because of environmental conditions such as vibration, external pressure, evaporation, and pollution. Second, most superhydrophobic surfaces fail to repel all types of liquids, especially those with low surface tensions. To address this bottleneck, microstructures with re‐entrant curvature have emerged, demonstrating excellent liquid‐repellent abilities and robustness. Additionally, microstructures with re‐entrant curvature have significant applications in designing surfaces with unidirectional wetting properties for passive liquid handling. Accordingly, this review systematically summarizes the design and fabrication strategies of these re‐entrant microstructures. The emphasis is given to wettability studies and other surface properties of re‐entrant microstructures and their applications, especially for liquid self‐transporting. This paper also highlights the potential applications and remaining technical challenges of fabricating these structures. Finally, the study is concluded by providing the future directions in this promising field.

Location
Deutsche Nationalbibliothek Frankfurt am Main
Extent
Online-Ressource
Language
Englisch

Bibliographic citation
Re‐Entrant Microstructures for Robust Liquid Repellent Surfaces ; day:03 ; month:02 ; year:2023 ; extent:23
Advanced Materials Technologies ; (03.02.2023) (gesamt 23)

Creator
Vu, Hoang Huy
Nguyen, Nam-Trung
Kashaninejad, Navid

DOI
10.1002/admt.202201836
URN
urn:nbn:de:101:1-2023020414073917697458
Rights
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Last update
21.02.0004, 9:57 AM CET

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