Phase Evolution at the Interface between Liquid Solder Sn-Zn-Ag and Cu Substrate Studied by In Situ Heating Scanning Transmission Electron Microscopy
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Extent
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Online-Ressource, 1 online resource.
- Language
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Englisch
- Bibliographic citation
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Phase Evolution at the Interface between Liquid Solder Sn-Zn-Ag and Cu Substrate Studied by In Situ Heating Scanning Transmission Electron Microscopy ; volume:32 ; number:13 ; day:22 ; month:5 ; year:2023 ; pages:5749-5755 ; date:7.2023
Journal of materials engineering and performance ; 32, Heft 13 (22.5.2023), 5749-5755, 7.2023
- Creator
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Czaja, Paweł
Dybeł, Aleksandra
Pstruś, Janusz
- Contributor
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SpringerLink (Online service)
- DOI
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10.1007/s11665-023-08284-8
- URN
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urn:nbn:de:101:1-2023100408425419654875
- Rights
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 11:01 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Czaja, Paweł
- Dybeł, Aleksandra
- Pstruś, Janusz
- SpringerLink (Online service)
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