- Location
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
-
1543-186X
- Extent
-
Online-Ressource
- Language
-
Englisch
- Notes
-
online resource.
- Bibliographic citation
-
Ag-(In-Bi) Solid–Liquid Interdiffusion Bonding ; volume:52 ; number:2 ; day:29 ; month:11 ; year:2022 ; pages:1284-1294 ; date:2.2023
Journal of electronic materials ; 52, Heft 2 (29.11.2022), 1284-1294, 2.2023
- Creator
-
Kuziora, Stéphane Léonard
Nguyen, Hoang-Vu
Aasmundtveit, Knut Eilif
- Contributor
-
SpringerLink (Online service)
- DOI
-
10.1007/s11664-022-10063-5
- URN
-
urn:nbn:de:101:1-2023031521264904804481
- Rights
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
-
14.08.2025, 10:45 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Kuziora, Stéphane Léonard
- Nguyen, Hoang-Vu
- Aasmundtveit, Knut Eilif
- SpringerLink (Online service)
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