Method to determine thermoelastic material properties of constituent and copper-patterned layers of multilayer printed circuit boards
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISSN
-
1573-482X
- Umfang
-
Online-Ressource
- Sprache
-
Englisch
- Anmerkungen
-
online resource.
- Erschienen in
-
Method to determine thermoelastic material properties of constituent and copper-patterned layers of multilayer printed circuit boards ; volume:29 ; number:6 ; day:4 ; month:1 ; year:2018 ; pages:4900-4914 ; date:3.2018
Journal of materials science / Materials in electronics ; 29, Heft 6 (4.1.2018), 4900-4914, 3.2018
- Klassifikation
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Ingenieurwissenschaften und Maschinenbau
- Urheber
-
Veldhuijzen van Zanten, J. F. J.
- Beteiligte Personen und Organisationen
-
Schuerink, G. A.
Tullemans, A. H. J.
Legtenberg, R.
Wits, Wessel W.
SpringerLink (Online service)
- DOI
-
10.1007/s10854-017-8449-2
- URN
-
urn:nbn:de:1111-2018041711601
- Rechteinformation
-
Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
- 14.08.2025, 11:02 MESZ
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Beteiligte
- Veldhuijzen van Zanten, J. F. J.
- Schuerink, G. A.
- Tullemans, A. H. J.
- Legtenberg, R.
- Wits, Wessel W.
- SpringerLink (Online service)
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