Stress evaluation and reliability of electrically conductive adhesive interconnections
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783934142596
- Maße
-
25 cm
- Umfang
-
X, 163 S.
- Sprache
-
Englisch
- Anmerkungen
-
Ill., graph. Darst.
Zugl.: Freiburg (Breisgau), Univ., Diss., 2009
- Erschienen in
-
Buchreihe Aufbau- und Verbindungstechnik in der Elektronik ; Bd. 10
- Klassifikation
-
Elektrotechnik, Elektronik
- Schlagwort
-
Klebeverbindung
Elektrische Leitfähigkeit
Zuverlässigkeit
Stoffeigenschaft
Temperaturverhalten
Feuchtigkeit
- Inhaltsverzeichnis
- Rechteinformation
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Letzte Aktualisierung
-
11.03.2025, 12:03 MEZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Beteiligte
- Löw, Richard Constantin
- Detert
Entstanden
- 2009
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