Hochschulschrift
Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces
- Standort
-
Deutsche Nationalbibliothek Frankfurt am Main
- ISBN
-
9783662488218
3662488213
- Maße
-
24 cm
- Umfang
-
xv, 143 Seiten
- Sprache
-
Englisch
- Anmerkungen
-
Illustrationen
- Klassifikation
-
Elektrotechnik, Elektronik
- Schlagwort
-
Lötverbindung
Lot
Bleifreies Produkt
Intermetallische Verbindungen
Zinnbronze
Scherfestigkeit
Mikrostruktur
Mechanische Beanspruchung
Mechanische Eigenschaft
- Ereignis
-
Veröffentlichung
- (wo)
-
Berlin, Heidelberg
- (wer)
-
Springer
- (wann)
-
[2016]
- Urheber
-
Zhang, Qingke
- Beteiligte Personen und Organisationen
- Inhaltsverzeichnis
- Rechteinformation
-
Bei diesem Objekt liegt nur das Inhaltsverzeichnis digital vor. Der Zugriff darauf ist unbeschränkt möglich.
- Letzte Aktualisierung
- 11.06.2025, 13:40 MESZ
Datenpartner
Dieses Objekt wird bereitgestellt von:
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Objekttyp
- Hochschulschrift
Beteiligte
- Zhang, Qingke
- Springer-Verlag GmbH
- Springer
Entstanden
- [2016]
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