A virtual metrology approach for maintenance compensation to improve yield in semiconductor manufacturing

Location
Deutsche Nationalbibliothek Frankfurt am Main
Extent
1 Online-Ressource.
Language
Englisch

Bibliographic citation
A virtual metrology approach for maintenance compensation to improve yield in semiconductor manufacturing ; volume:7 ; number:2 ; day:1 ; month:7 ; year:2014 ; pages:66-73 ; date:7.2014
International journal of computational intelligence systems ; 7, Heft 2 (1.7.2014), 66-73, 7.2014

Creator
Lin, Kuo-Yi
Hsu, Chia-Yu
Yu, Hui-Chun
Contributor
SpringerLink (Online service)

DOI
10.1080/18756891.2014.947116
URN
urn:nbn:de:101:1-2024031813503920602587
Rights
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Last update
14.08.2025, 11:02 AM CEST

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Associated

  • Lin, Kuo-Yi
  • Hsu, Chia-Yu
  • Yu, Hui-Chun
  • SpringerLink (Online service)

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