A virtual metrology approach for maintenance compensation to improve yield in semiconductor manufacturing
- Standort
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Deutsche Nationalbibliothek Frankfurt am Main
- Umfang
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1 Online-Ressource.
- Sprache
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Englisch
- Erschienen in
-
A virtual metrology approach for maintenance compensation to improve yield in semiconductor manufacturing ; volume:7 ; number:2 ; day:1 ; month:7 ; year:2014 ; pages:66-73 ; date:7.2014
International journal of computational intelligence systems ; 7, Heft 2 (1.7.2014), 66-73, 7.2014
- Urheber
-
Lin, Kuo-Yi
Hsu, Chia-Yu
Yu, Hui-Chun
- Beteiligte Personen und Organisationen
-
SpringerLink (Online service)
- DOI
-
10.1080/18756891.2014.947116
- URN
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urn:nbn:de:101:1-2024031813503920602587
- Rechteinformation
-
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Letzte Aktualisierung
- 14.08.2025, 11:02 MESZ
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Beteiligte
- Lin, Kuo-Yi
- Hsu, Chia-Yu
- Yu, Hui-Chun
- SpringerLink (Online service)
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