Carbon nanotube bumps for the flip chip packaging system

Location
Deutsche Nationalbibliothek Frankfurt am Main
ISSN
1556-276X
Extent
Online-Ressource
Language
Englisch
Notes
online resource.

Bibliographic citation
Carbon nanotube bumps for the flip chip packaging system ; volume:7 ; number:1 ; day:7 ; month:2 ; year:2012 ; pages:1-8 ; date:12.2012
Nanoscale research letters ; 7, Heft 1 (7.2.2012), 1-8, 12.2012

Classification
Ingenieurwissenschaften und Maschinenbau

Creator
Yap, Chin Chong
Brun, Christophe
Tan, Dunlin
Li, Hong
Teo, Edwin Hang Tong
Baillargeat, Dominique
Tay, Beng Kang
Contributor
SpringerLink (Online service)

DOI
10.1186/1556-276X-7-105
URN
urn:nbn:de:101:1-2019091309103395342970
Rights
Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
Last update
15.08.2025, 7:22 AM CEST

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Associated

  • Yap, Chin Chong
  • Brun, Christophe
  • Tan, Dunlin
  • Li, Hong
  • Teo, Edwin Hang Tong
  • Baillargeat, Dominique
  • Tay, Beng Kang
  • SpringerLink (Online service)

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