Fabrication and simulation study for vertical micro-TEGs based on printed circuit board manufacturing processes

Abstract: The development of fabrication procedures for micro-thermoelectric generators (µTEGs) based on low-cost fabrication technologies, appropriate for mass production is discussed and demonstrated in this study. Simulations were carried out, two manufacturing processes were tested, and device performance is compared to simulation results for vertical µTEGs. The substrate for this device is a printed circuit board, and the thermoelectric materials are self-developed Bi0.5Sb1.5Te3 (p-type) and Bi2Te2.7Se0.3 (n-type) pastes. A square µTEG (15 mm × 15 mm × 500 µm) with eight thermocouples (TCs) was fabricated. The characterization of the fabricated 8-TC-µTEG was carried out and a power output of 1.23 µW was obtained for the fabricated 8-TC-µTEG. The measurement results of this 8-TC-µTEG closely match simulation results as well. Moreover, a novel vertical electrical contact resistance measurement setup is designed and implemented into the final evaluation of µTEG production to have a more accurate assessment. The simulation study is also applied for the designed electrical contact resistance measurement setup. As a result, the contact resistivity of Bi2Te3/Cu was calculated as 5.65 × 10−4 Ωcm2

Objekt anzeigen

• Standort: Deutsche Nationalbibliothek Frankfurt am Main
• Umfang: Online-Ressource
• Sprache: Englisch
• Anmerkungen: Smart materials and structures. - 31, 10 (2022) , 104003, ISSN: 1361-665X

Klassifikation und Themen

• Klassifikation: Elektrotechnik, Elektronik

Beteiligte, Orts- und Zeitangaben

• Ereignis: Veröffentlichung
• (wo): Freiburg
• (wer): Universität
• (wann): 2022
• Urheber: Sherkat, Negin ; Kattiparambil Sivaprasad, Athira ; Pelz, Uwe Martin ; Woias, Peter
• Beteiligte Personen und Organisationen: Albert-Ludwigs-Universität Freiburg. Professur für die Konstruktion von Mikrosystemen

Weitere Informationen

• DOI: 10.1088/1361-665X/ac8dcd
• URN: urn:nbn:de:bsz:25-freidok-2293683
• Rechteinformation: Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.