Nanocrystalline copper for direct copper-to-copper bonding with improved cross-interface formation at low thermal budget
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Extent
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1 Online-Ressource.
- Language
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Englisch
- Bibliographic citation
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Nanocrystalline copper for direct copper-to-copper bonding with improved cross-interface formation at low thermal budget ; volume:15 ; number:1 ; day:17 ; month:8 ; year:2024 ; pages:1-11 ; date:12.2024
Nature Communications ; 15, Heft 1 (17.8.2024), 1-11, 12.2024
- Creator
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He, Chuan
Zhou, Jingzhuo
Zhou, Rui
Chen, Cong
Jing, Siyi
Mu, Kaiyu
Huang, Yu-Ting
Chung, Chih-Chun
Cherng, Sheng-Jye
Lu, Yang
Tu, King-Ning
Feng, Shien-Ping
- Contributor
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SpringerLink (Online service)
- DOI
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10.1038/s41467-024-51510-7
- URN
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urn:nbn:de:101:1-2411042122519.748775399601
- Rights
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Open Access; Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
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15.08.2025, 7:38 AM CEST
Data provider
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Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- He, Chuan
- Zhou, Jingzhuo
- Zhou, Rui
- Chen, Cong
- Jing, Siyi
- Mu, Kaiyu
- Huang, Yu-Ting
- Chung, Chih-Chun
- Cherng, Sheng-Jye
- Lu, Yang
- Tu, King-Ning
- Feng, Shien-Ping
- SpringerLink (Online service)
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