Rapid detection of cleanliness on direct bonded copper substrate by using UV hyperspectral imaging
- Location
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Deutsche Nationalbibliothek Frankfurt am Main
- Extent
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Online-Ressource
- Language
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Englisch
- Bibliographic citation
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In: Sensors 24, 14, 4680, S. 1-12
- Event
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Veröffentlichung
- (where)
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Reutlingen
- (who)
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Hochschule Reutlingen
- (when)
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2024
- Creator
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Knoblich, Mona
Al Ktash, Mohammad
Wackenhut, Frank
Englert, Tim
Stiedl, Jan
Wittel, Hilmar
Green, Simon
Jacob, Timo
Boldrini, Barbara
Ostertag, Edwin
Rebner, Karsten
Brecht, Marc
- DOI
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10.3390/s24144680
- URN
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urn:nbn:de:bsz:rt2-opus4-52848
- Rights
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Der Zugriff auf das Objekt ist unbeschränkt möglich.
- Last update
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15.08.2025, 7:22 AM CEST
Data provider
This object is provided by:
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Deutsche Nationalbibliothek. If you have any questions about the object, please contact the data provider.
Associated
- Knoblich, Mona
- Al Ktash, Mohammad
- Wackenhut, Frank
- Englert, Tim
- Stiedl, Jan
- Wittel, Hilmar
- Green, Simon
- Jacob, Timo
- Boldrini, Barbara
- Ostertag, Edwin
- Rebner, Karsten
- Brecht, Marc
- Hochschule Reutlingen
Time of origin
- 2024
Other Objects (12)
UV hyperspectral imaging as process analytical tool for the characterization of oxide layers and copper states on direct bonded copper
Lebensdauermodellierung von Aluminiumoxid-basierten Direct Bonded Copper-Substraten
Impedance characterization of substrate leakage in wafer bonded CMUTs
Investigation of UV exposure in adhesively bonded single lap joints
Advanced total column ozone retrieval from hyperspectral UV satellite instruments
Development of a UV Hyperspectral Imaging Prototype for Industrial Applications
Extending Hyperspectral Imaging for Plant Phenotyping to the UV-Range
Strukturelle Klebungen mit UV- und lichthärtenden Acrylaten : = Structural bonded joints with UV and light curing acrylates
Inkjet printing of copper wire on PET substrate
Deposition of metallic copper through UV light irradiation
Feasibility Study on Magnetorheological Finishing of Thin Copper Substrate
Characterisation of oxide layers on technical copper based on visible hyperspectral imaging
UV hyperspectral imaging as process analytical tool for the characterization of oxide layers and copper states on direct bonded copper
Lebensdauermodellierung von Aluminiumoxid-basierten Direct Bonded Copper-Substraten
Impedance characterization of substrate leakage in wafer bonded CMUTs
Investigation of UV exposure in adhesively bonded single lap joints
Advanced total column ozone retrieval from hyperspectral UV satellite instruments
Development of a UV Hyperspectral Imaging Prototype for Industrial Applications
Extending Hyperspectral Imaging for Plant Phenotyping to the UV-Range
Strukturelle Klebungen mit UV- und lichthärtenden Acrylaten : = Structural bonded joints with UV and light curing acrylates
Inkjet printing of copper wire on PET substrate
Deposition of metallic copper through UV light irradiation
Feasibility Study on Magnetorheological Finishing of Thin Copper Substrate
Characterisation of oxide layers on technical copper based on visible hyperspectral imaging
UV hyperspectral imaging as process analytical tool for the characterization of oxide layers and copper states on direct bonded copper
Lebensdauermodellierung von Aluminiumoxid-basierten Direct Bonded Copper-Substraten
Impedance characterization of substrate leakage in wafer bonded CMUTs
Investigation of UV exposure in adhesively bonded single lap joints
Advanced total column ozone retrieval from hyperspectral UV satellite instruments
Development of a UV Hyperspectral Imaging Prototype for Industrial Applications
Extending Hyperspectral Imaging for Plant Phenotyping to the UV-Range
Strukturelle Klebungen mit UV- und lichthärtenden Acrylaten : = Structural bonded joints with UV and light curing acrylates
Inkjet printing of copper wire on PET substrate
Deposition of metallic copper through UV light irradiation
Feasibility Study on Magnetorheological Finishing of Thin Copper Substrate